{"_id":"agxzfmlsbGlzdHNpdGVyGAsSC05ld19Db21wYW55GICAoIWEnosLDA","lastupdate":"2024-04-10T00:00:00.000Z","update_date":"2024-04-10T00:00:00.000Z","lastModified":"Sep 28, 2024","active":1,"confidence_score":98,"confidence_score_reason":"markets","urlname":"ciphersip","minimal_profile":null,"status":"","fullstatus":"","acquired":0,"hide_reason":null,"hide_reason_data":null,"hide_reasons":[{"id":"8257rxn4P8EFQOmS5hAAauHyYMhhxrA5u6yWX4XUShpybX3AMNo3Y9","reason":"Pending approval - External entity"},{"id":"aOIaOiiqfpA8UMw6VCTh8ueRmkG3lzDy1NGqEOaJbe11OrCzMTCCd6","reason":"The company is a service provider"},{"id":"ddgjKuc3GgH8E5UehSVJviRl471BCajL1plO8HtGoOojy2NivYqQ7x","reason":"Owner asked to delete"},{"id":"EjOKM211H1ira9J63oaGPuUxvr7Oba55TZo3NWsFO5uhbNu7o4x4zD","reason":"The company is not Israeli"},{"id":"J7fQJtnT3GdWWSE3MD8rzaW65LJ4jEIKxSZnneQiReONdZjG3zIqWe","reason":"Owner asked to hide in the meantime"},{"id":"NxlAC3ReFb5ksiYNLp2FnUyluoJzwRCYfcF7xpTZaPM53SdWQ5kv0B","reason":"Pending approval"},{"id":"RhC1tlwXzioK0MfzBII3H2wepEfQOfKVktmdwqeqTJjGi3ZaBWUqZo","reason":"The company is not innovative"},{"id":"S0Ed46vNI6vZYVxLedANWGjas23K6hY0QdsCtiGYL7lshqIEdLV3sA","reason":"The company ceased operations in Israel"},{"id":"VTANq7bEvlsEcPjp0ghelXfShaCosgndONGjgU730aAOxXtaDIF5j3","reason":"This is a product of an existing company"}],"type":"Startup","logokey":"$28TMO4jbg0kEMvliDS2HnWGlg57swbW5qKXkSv5IfAJBAC4KBUBtS9.png","name":"CipherSiP","oneliner":"Secured High-speed Connectivity ","registrar":"515863157","website":"https://ciphersip.com","careerspage":"","founded_month":1,"founded_year":2018,"formernames":[],"sociallinks":{"twitter":"","youtube":"","facebook":"","linkedin":"https://www.linkedin.com/company/29036573","instagram":""},"social":["https://www.linkedin.com/company/29036573"],"flattenedsociallinks":"https://www.linkedin.com/company/29036573","apps":{"appstore":"","googleplay":""},"is_claimed_by_owner":1,"employees":"1-10","employees_exact":2,"patent":1,"raised":4000000,"stage":"Seed","public_stage":"Seed","primary_sector_key":"agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PuDstIIDA","primary_sector":"Cyber Security","alternativenames":[""],"about":"CipherSiP’s patented technology provides secured high bandwidth, high-speed communication solutions over the exsiting CAN BUS protocol and a Bridge of CANEthernet, based on the existing transceivers which enables transmission of high bit rate and large data payloads in multiple application - industrial, automotive, aerospace and stationary systems.","climatetech_description":null,"is_climatetech_relevant":null,"phone":"","country":null,"address":{"israeli":[{"id":"e2e44c6e-42ff-444f-b9dc-debd30f33612","city":"Haifa","type":null,"address":"Andrei Sakharov 9, Haifa, Israel","placeid":null,"notactive":0,"openeddate":null,"registrarid":null,"firstrdcenter":0,"registrarname":null}],"officesabroad":[{"id":"d818b4f8-1074-4d72-abe1-409b71d1f6e5","city":"Zug","address":"Unter Altstadt 10, Zug, Switzerland","country":"Switzerland","placeid":null}]},"headquarter_address":null,"district":"North District","news":[{"id":"bc5c69c8-843d-4d50-99d0-bfe2d649d6b0","date":"Jan 2, 2020","link":"https://nocamels.com/2020/01/israel-tech-ces-las-vegas-2020-statement/","source":"nocamels.com","visible":1,"analysis":{"tags":"technology, consumer electronics","company":"Israeli Ministry of Economy and Industry","layoffs":null,"summary":"Israeli-founded companies are participating in the CES conference in Las Vegas to showcase new products and technologies in the consumer electronics industry. The Israeli Ministry of Economy and Industry and the Israel Export Institute have organized a delegation of 22 Israeli companies to attend the conference. The companies cover various technology categories such as AR/VR, robotics, smart cities, and more. Additionally, several Israeli startups are also participating in the conference. The CES conference is expected to attract over 175,000 attendees and will feature 4,500 exhibitors and more than 1,100 speakers.","partners":null,"customers":null,"investors":"Hyundai, Intel Capital, Porsche","confidence":9,"key_topics":["CES","Israeli companies","AR/VR","robotics","smart cities"],"date_of_event":"January 7-10","valuation_amount":null,"impact_on_company":"growth-positive","investment_amount":null,"structured_issues":["Partners","Investment"],"acquisition_amount":null,"structuredIssuesShow":"#Partners  #Investment","entityGrowthIconPath":"url(/assets/circle-green.svg);"},"sentiment":"growth-positive","analysisId":"vQMTYZFIkT9X7kzZ1zHhIiEu55cDOX6fa7Qyulw1QQQrDk7Yt20Eau","news_summary":"Trailblazing Israeli Tech Heads To CES 2020","analysisStructuredIssuesDisplay":"block","analysisImpactOnCompanyDisplay":"block"},{"id":"1752b51f-904a-4690-b3d0-6532c6cf98d0","date":"Jan 6, 2019","link":"https://nocamels.com/2019/01/israeli-tech-ces-2019/","source":"nocamels.com","visible":1,"analysis":{"tags":"technology, CES","company":"Israeli startups","layoffs":null,"summary":"Nearly three dozen Israeli startups are participating in the annual CES conference in Las Vegas. The startups are showcasing their groundbreaking technologies in fields such as robotics, autonomous driving, and Big Data. The CES conference is known for introducing next-generation innovations to the marketplace. Over 180,000 people are expected to attend the conference, which features more than 4,000 exhibiting companies and 1,000 speakers. Some of the Israeli startups participating in the conference include Anagog, Brodmann17, Edgybees, Gauzy, Hexa, Lishtot, Lumen, Nanoscent, NFT Inc, Qlone, Sixdof Space, Superb Reality Ltd., Syte ai, Talamoos, TriEye, Unbotify, Waycare, Woojer Ltd., TechSee, Engie, C2A Security, Vayavision, Mobileye, Arbe Robotics, Karamba Security, Innoviz Technologies, Temi, Mantis Vision, Vayyar Imaging, and Valerann.","partners":null,"customers":null,"investors":"Daimler AG, Skoda, Porsche Digital GmbH, Viola Ventures, OurCrowd, MizMaa Ventures, LG Electronics, Mitsubishi UFJ Capital, Intel, Aptiv, Magna International, Samsung, Magma Venture Partners, Vertex Ventures, SoftBank Ventures Korea, 360 Capital Partners","confidence":9,"key_topics":["Israeli startups","CES","technology","innovation","exhibitors"],"date_of_event":"January 8-11, 2019","valuation_amount":null,"impact_on_company":"growth-positive","investment_amount":null,"structured_issues":["Partners","Investment"],"acquisition_amount":null,"structuredIssuesShow":"#Partners  #Investment","entityGrowthIconPath":"url(/assets/circle-green.svg);"},"sentiment":"growth-positive","analysisId":"rvqr87viXlz00OG6aZyVZQwe8NvfFRJUA2Mv80ZXspufcGCIAiiNKP","news_summary":"The Groundbreaking Israeli Tech Turning Heads At CES 2019","analysisStructuredIssuesDisplay":"block","analysisImpactOnCompanyDisplay":"block"}],"newsNumber":2,"techcommunityinvolvement":null,"mediagallery":[{"id":"awztp4xHP7bAnW1K9eopq5aE9u2BaeGOqgZ2HqXBS0HabqF0UQVfSq","timestamp":"2023-05-31 13:34:59.000000","resources_type":2,"resources_title":"","resources_file_name":"7x35n1Mf54s","alt":"","imageurl":"https://img.youtube.com/vi/7x35n1Mf54s/0.jpg","url":"http://youtu.be/7x35n1Mf54s"}],"tags":["bandwidth","iot","cyber-security","data-protection","authentication","automotive","smart-mobility","connected-vehicles","industry-4.0"],"classificationIDs":["agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4IfQ4Z8IDA","agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4NuxioUJDA","agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Lu1i8MIDA","agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Oek-_oKDA","agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZ7rMLDA","agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Iety68KDA","agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PvavvYLDA","agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZiooIDA","agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Puom_sKDA","agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PvppskJDA","agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZt7YLDA","agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PuDstIIDA","agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Lu-8dwLDA","agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Iee18sKDA","agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PuayYIIDA"],"technologysuccessstory":null,"usecases":[],"businessmodels":["B2B"],"productstage":"Released","products":[],"geomarkets":["Global"],"targetmarkets":[],"marketcapital":null,"marketcapitaldate":null,"funding":{"investors":0,"lastfunding":"$4M","totalrounds":1,"fundingstage":"Seed","totalfunding":"$4M","publicinvestors":0,"lastpublicfunding":4000000,"totalpublicrounds":1,"totalpublicfunding":4000000},"team":[{"name":"Eldad Caspi","email":"eldad@ciphersip.com","phone":"","gender":"Male","userid":"agxzfmlsbGlzdHNpdGVyFQsSCE5ld19Vc2VyGICAoLmA-6wIDA","bounced":true,"claimed":1,"founder":1,"urlname":"eldad-caspi-1","visible":1,"memberid":"agxzfmlsbGlzdHNpdGVyFwsSCk5ld19NZW1iZXIYgICguY3DzAoM","position":"Co-founder & CEO","last_name":"Caspi","claimtoken":"ec92c946d85bdedf100602418712ea0d619be9f01f9bdb0b17e60393a77a869f","first_name":"Eldad","picturekey":"$0K1teVixwqDcx2vAA9ZkTuSXaVxlblZt4cqGt985Oj62aSMbpKPlqC","claimeddate":"2021-07-06","linkedinurl":"https://www.linkedin.com/in/eldadcaspiceo/","unsubscribed":false,"is_activeuser":1,"additionalemail":"","claimedemaildate":"2021-07-06 09:38:06.000000","initials":"","pictureurl":"https://storage.googleapis.com/clean-finder-353810/$0K1teVixwqDcx2vAA9ZkTuSXaVxlblZt4cqGt985Oj62aSMbpKPlqC","linkedin-display":"flex","teammembertagclass":"none","teammembertagcontent":"","channelId":"","visibilityClassName":"","visibilityTooltip":""},{"name":"Rami Ezer","email":"rami@ciphersip.com","phone":"","gender":"Male","userid":"agxzfmlsbGlzdHNpdGVyFQsSCE5ld19Vc2VyGICAoIW63LYIDA","bounced":false,"claimed":1,"founder":1,"urlname":"rami-ezer-1","visible":1,"memberid":"agxzfmlsbGlzdHNpdGVyFwsSCk5ld19NZW1iZXIYgICg2Y2pzwoM","position":"Co-founder, COO & VP R&D","last_name":"Ezer","claimtoken":"f9909bc129ff6119d3519df5b2ce19c35d5c78e577e86860033d469a978afe8d","first_name":"Rami","picturekey":"$8MEYRXeSwcNPm68qY1fLGZcxmq98xyqmaQ9oAtzj9EX7pvOik1sbi0","claimeddate":"2018-06-20","linkedinurl":"https://www.linkedin.com/in/rami-ezer-a06832165","unsubscribed":false,"is_activeuser":1,"additionalemail":"","claimedemaildate":"2018-06-20 06:13:22.000000","initials":"","pictureurl":"https://storage.googleapis.com/clean-finder-353810/$8MEYRXeSwcNPm68qY1fLGZcxmq98xyqmaQ9oAtzj9EX7pvOik1sbi0","linkedin-display":"flex","teammembertagclass":"connect","teammembertagcontent":"Connect","channelId":"","visibilityClassName":"","visibilityTooltip":""}],"description_edited":1,"tag_line_edited":1,"sector":"Security Technologies","sectorverify":null,"biverify":{"id":"agxzfmlsbGlzdHNpdGVyFQsSCE5ld19Vc2VyGICAgMHXnNsIDA","fullname":"Jenny Sotnik-Talisman"},"biverifydate":"2020-05-27T00:00:00.000Z","crunchbaseid":"ciphersip","lastupdator":"Yanina Wainscheinker","lastupdator_email":"yanina.wainscheinker@sncentral.org","creator":"Jenny Sotnik-Talisman","creator_email":"genys30@yahoo.com","createdate":"2018-06-19T00:00:00.000Z","biverification":"Jenny Sotnik-Talisman","sectorverification":null,"affiliatedOrganizations":null,"timeline":[{"id":"aFENlmkMOPUOKNRqWN30xCaLsVjyKQzjWZX8Y9loHzPssNTSTbUf9V","date":"Jan 2020","amount":"$4M","source":"Elad Caspi","eventtype":"FundingRoundEvent","investment":[],"eventvisibility":"Public","amountvisibility":"Public","fundingvisibility":"Public","fundingtypefundingtype":"Seed","style":"","hiddenCompanyTooltip":"","fundingvisibilityClassName":"","fundingvisibilityTooltip":"","amountvisibilityClassName":"","amountvisibilityTooltip":"","token_visibilityClassName":"","token_visibilityTooltip":"","sectionname":"Private Equity Funding","amountnumber":4000000,"capitalraised":"Undisclosed","valuation":"Undisclosed"},{"id":"KOY83bsdPqCWTg64dbBEp6WYn5s6ZItXGoMQAYObHQLDVEWThDt1uw","hub":"DRIVE TLV","date":"","batch":"","amount":"Undisclosed","hub_id":"agxzfmlsbGlzdHNpdGVyGAsSC05ld19Db21wYW55GICAoObOobALDA","source":"","enddate":"","hub_type":"Accelerator","eventtype":"GraduationEvent","hub_hidden":false,"investment":[],"hub_fullurl":"/program_page/drive-tlv","hub_logokey":"$hiHLayqkQFZiQoyzdlTw0ZRSdDtIMQIX1SIOV5l1ZmKYvFsvUeyQyE","hub_urlname":"/program_page/drive-tlv","eventvisibility":null,"amountvisibility":null,"fundingvisibility":null,"style":"","hiddenCompanyTooltip":"","hub_logourl":"https://storage.googleapis.com/clean-finder-353810/$hiHLayqkQFZiQoyzdlTw0ZRSdDtIMQIX1SIOV5l1ZmKYvFsvUeyQyE","amountnumber":null,"capitalraised":"Undisclosed","valuation":"Undisclosed"}],"investmentstage":[],"exits":[],"investments":[],"portfolio":[],"funds":[],"founded":"1/2018","databases":[],"sharedspaces":[],"utilities":[],"contributors":[],"employeesworldwide":"","fundingtype":"Startup","parsedName":"CipherSiP","logourl":"https://storage.googleapis.com/clean-finder-353810/$28TMO4jbg0kEMvliDS2HnWGlg57swbW5qKXkSv5IfAJBAC4KBUBtS9.png","oglogourl":"https://storage.googleapis.com/clean-finder-353810/$28TMO4jbg0kEMvliDS2HnWGlg57swbW5qKXkSv5IfAJBAC4KBUBtS9.png","seoabout":"CipherSiP’s patented technology provides secured high bandwidth, high-speed communication solutions over the exsiting CAN BUS protocol and a Bridge of CANE...","seoTitle":"Israeli Startup","solutions":[],"teamMembersNumber":2,"primarySector":"Cyber Security","primary-sector-display":"block","classifications":[{"depth":0,"name":"Sector","queryString":"sectorclassification=undefined","classificationName":"sectorclassification"},{"depth":1,"name":"Cyber Security","queryString":"sectorclassification=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PuDstIIDA","classificationName":"sectorclassification"},{"depth":2,"name":"Network & Infrastructure Security","queryString":"sectorclassification=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Lu-8dwLDA","classificationName":"sectorclassification"},{"depth":1,"name":"Automotive & Mobility Technologies","queryString":"sectorclassification=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Iee18sKDA","classificationName":"sectorclassification"},{"depth":2,"name":"Autonomous & Connected","queryString":"sectorclassification=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PuayYIIDA","classificationName":"sectorclassification"},{"depth":0,"name":"Core Technology","queryString":"coretechnology=undefined","classificationName":"coretechnology"},{"depth":1,"name":"Platforms & Interfaces","queryString":"coretechnology=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4NuxioUJDA","classificationName":"coretechnology"},{"depth":2,"name":"Software","queryString":"coretechnology=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Lu1i8MIDA","classificationName":"coretechnology"},{"depth":1,"name":"Semiconductors & Electronics","queryString":"coretechnology=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZ7rMLDA","classificationName":"coretechnology"},{"depth":2,"name":"System-on-a-chip","queryString":"coretechnology=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZiooIDA","classificationName":"coretechnology"},{"depth":2,"name":"Chipsets","queryString":"coretechnology=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZt7YLDA","classificationName":"coretechnology"},{"depth":1,"name":"Communications","queryString":"coretechnology=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Iety68KDA","classificationName":"coretechnology"},{"depth":0,"name":"Target Customer","queryString":"targetcustomer=undefined","classificationName":"targetcustomer"},{"depth":1,"name":"Industrial Manufacturing","queryString":"targetcustomer=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Puom_sKDA","classificationName":"targetcustomer"},{"depth":2,"name":"Discrete Industries","queryString":"targetcustomer=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PvppskJDA","classificationName":"targetcustomer"},{"depth":3,"name":"Automotive","queryString":"targetcustomer=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4IfQ4Z8IDA","classificationName":"targetcustomer"},{"depth":3,"name":"Aerospace","queryString":"targetcustomer=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PvavvYLDA","classificationName":"targetcustomer"},{"depth":2,"name":"Manufacturing Facilities","queryString":"targetcustomer=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Oek-_oKDA","classificationName":"targetcustomer"}],"classificationDelimited":["IndustryClassificationModel>Industrial Manufacturing#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Puom_sKDA>Discrete Industries#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PvppskJDA>Automotive#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4IfQ4Z8IDA","TechnologyClassificationModel>Platforms & Interfaces#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4NuxioUJDA","TechnologyClassificationModel>Platforms & Interfaces#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4NuxioUJDA>Software#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Lu1i8MIDA","IndustryClassificationModel>Industrial Manufacturing#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Puom_sKDA>Manufacturing Facilities#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Oek-_oKDA","TechnologyClassificationModel>Semiconductors & Electronics#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZ7rMLDA","TechnologyClassificationModel>Communications#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Iety68KDA","IndustryClassificationModel>Industrial Manufacturing#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Puom_sKDA>Discrete Industries#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PvppskJDA>Aerospace#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PvavvYLDA","TechnologyClassificationModel>Semiconductors & Electronics#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZ7rMLDA>System-on-a-chip#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZiooIDA","IndustryClassificationModel>Industrial Manufacturing#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Puom_sKDA","IndustryClassificationModel>Industrial Manufacturing#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Puom_sKDA>Discrete Industries#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PvppskJDA","TechnologyClassificationModel>Semiconductors & Electronics#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZ7rMLDA>Chipsets#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZt7YLDA","SectorClassificationModel>Cyber Security#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PuDstIIDA","SectorClassificationModel>Cyber Security#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PuDstIIDA>Network & Infrastructure Security#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Lu-8dwLDA","SectorClassificationModel>Automotive & Mobility Technologies#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Iee18sKDA","SectorClassificationModel>Automotive & Mobility Technologies#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Iee18sKDA>Autonomous & Connected#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PuayYIIDA"],"classificationsViewModel":"|0:>IndustryClassificationModel|1:>IndustryClassificationModel/Industrial Manufacturing#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Puom_sKDA|2:>IndustryClassificationModel>Industrial Manufacturing#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Puom_sKDA/Discrete Industries#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PvppskJDA|3:>IndustryClassificationModel>Industrial Manufacturing#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Puom_sKDA>Discrete Industries#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PvppskJDA/Automotive#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4IfQ4Z8IDA|3:>IndustryClassificationModel>Industrial Manufacturing#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Puom_sKDA>Discrete Industries#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PvppskJDA/Aerospace#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PvavvYLDA|2:>IndustryClassificationModel>Industrial Manufacturing#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Puom_sKDA/Manufacturing Facilities#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Oek-_oKDA|0:>TechnologyClassificationModel|1:>TechnologyClassificationModel/Platforms & Interfaces#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4NuxioUJDA|2:>TechnologyClassificationModel>Platforms & Interfaces#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4NuxioUJDA/Software#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Lu1i8MIDA|1:>TechnologyClassificationModel/Semiconductors & Electronics#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZ7rMLDA|2:>TechnologyClassificationModel>Semiconductors & Electronics#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZ7rMLDA/System-on-a-chip#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZiooIDA|2:>TechnologyClassificationModel>Semiconductors & Electronics#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZ7rMLDA/Chipsets#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZt7YLDA|1:>TechnologyClassificationModel/Communications#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Iety68KDA|0:>SectorClassificationModel|1:>SectorClassificationModel/Cyber Security#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PuDstIIDA|2:>SectorClassificationModel>Cyber Security#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PuDstIIDA/Network & Infrastructure Security#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Lu-8dwLDA|1:>SectorClassificationModel/Automotive & Mobility Technologies#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Iee18sKDA|2:>SectorClassificationModel>Automotive & Mobility Technologies#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Iee18sKDA/Autonomous & Connected#agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PuayYIIDA|","classificationTrees":{"sector":[{"title":"Cyber Security","key":"0-0","path":"SectorClassificationModel>Cyber Security","children":[{"title":"Network & Infrastructure Security","key":"0-0-0","path":"SectorClassificationModel>Cyber Security>Network & Infrastructure Security"}]},{"title":"Automotive & Mobility Technologies","key":"0-1","path":"SectorClassificationModel>Automotive & Mobility Technologies","children":[{"title":"Autonomous & Connected","key":"0-1-0","path":"SectorClassificationModel>Automotive & Mobility Technologies>Autonomous & Connected"}]}],"targetCustomer":[{"title":"Industrial Manufacturing","key":"0-0","path":"IndustryClassificationModel>Industrial Manufacturing","children":[{"title":"Discrete Industries","key":"0-0-0","path":"IndustryClassificationModel>Industrial Manufacturing>Discrete Industries","children":[{"title":"Automotive","key":"0-0-0-0","path":"IndustryClassificationModel>Industrial Manufacturing>Discrete Industries>Automotive"},{"title":"Aerospace","key":"0-0-0-1","path":"IndustryClassificationModel>Industrial Manufacturing>Discrete Industries>Aerospace"}]},{"title":"Manufacturing Facilities","key":"0-0-1","path":"IndustryClassificationModel>Industrial Manufacturing>Manufacturing Facilities"}]}],"coreTechnology":[{"title":"Platforms & Interfaces","key":"0-0","path":"TechnologyClassificationModel>Platforms & Interfaces","children":[{"title":"Software","key":"0-0-0","path":"TechnologyClassificationModel>Platforms & Interfaces>Software"}]},{"title":"Semiconductors & Electronics","key":"0-1","path":"TechnologyClassificationModel>Semiconductors & Electronics","children":[{"title":"System-on-a-chip","key":"0-1-0","path":"TechnologyClassificationModel>Semiconductors & Electronics>System-on-a-chip"},{"title":"Chipsets","key":"0-1-1","path":"TechnologyClassificationModel>Semiconductors & Electronics>Chipsets"}]},{"title":"Communications","key":"0-2","path":"TechnologyClassificationModel>Communications"}]},"sectorClassifications":[{"depth":0,"name":"Sector","queryString":"sectorclassification=undefined","classificationName":"sectorclassification"},{"depth":1,"name":"Cyber Security","queryString":"sectorclassification=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PuDstIIDA","classificationName":"sectorclassification"},{"depth":2,"name":"Network & Infrastructure Security","queryString":"sectorclassification=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Lu-8dwLDA","classificationName":"sectorclassification"},{"depth":1,"name":"Automotive & Mobility Technologies","queryString":"sectorclassification=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Iee18sKDA","classificationName":"sectorclassification"},{"depth":2,"name":"Autonomous & Connected","queryString":"sectorclassification=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PuayYIIDA","classificationName":"sectorclassification"}],"coreTechnologyClassifications":[{"depth":0,"name":"Core Technology","queryString":"coretechnology=undefined","classificationName":"coretechnology"},{"depth":1,"name":"Platforms & Interfaces","queryString":"coretechnology=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4NuxioUJDA","classificationName":"coretechnology"},{"depth":2,"name":"Software","queryString":"coretechnology=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Lu1i8MIDA","classificationName":"coretechnology"},{"depth":1,"name":"Semiconductors & Electronics","queryString":"coretechnology=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZ7rMLDA","classificationName":"coretechnology"},{"depth":2,"name":"System-on-a-chip","queryString":"coretechnology=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZiooIDA","classificationName":"coretechnology"},{"depth":2,"name":"Chipsets","queryString":"coretechnology=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4JvZt7YLDA","classificationName":"coretechnology"},{"depth":1,"name":"Communications","queryString":"coretechnology=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Iety68KDA","classificationName":"coretechnology"}],"targetCustomerClassifications":[{"depth":0,"name":"Target Customer","queryString":"targetcustomer=undefined","classificationName":"targetcustomer"},{"depth":1,"name":"Industrial Manufacturing","queryString":"targetcustomer=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Puom_sKDA","classificationName":"targetcustomer"},{"depth":2,"name":"Discrete Industries","queryString":"targetcustomer=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PvppskJDA","classificationName":"targetcustomer"},{"depth":3,"name":"Automotive","queryString":"targetcustomer=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4IfQ4Z8IDA","classificationName":"targetcustomer"},{"depth":3,"name":"Aerospace","queryString":"targetcustomer=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4PvavvYLDA","classificationName":"targetcustomer"},{"depth":2,"name":"Manufacturing Facilities","queryString":"targetcustomer=agxzfmlsbGlzdHNpdGVyJAsSF0Jhc2VDbGFzc2lmaWNhdGlvbk1vZGVsGICA4Oek-_oKDA","classificationName":"targetcustomer"}],"classificationNames":{"sector":["Cyber Security","Network & Infrastructure Security","Automotive & Mobility Technologies","Autonomous & Connected"],"coreTechnology":["Platforms & Interfaces","Software","Semiconductors & Electronics","System-on-a-chip","Chipsets","Communications"],"targetCustomer":["Industrial Manufacturing","Discrete Industries","Automotive","Aerospace","Manufacturing Facilities"]},"section":null,"sectionParams":"","queryParams":"","popup_claim_profile":"false","claimedBadge":"inline","display":{"mainContact":"none","climateTag":"none","seeMoreSimilarCompanisDisplay":"none","similarCompaniesTitleFontSize":"3.2rem","similarCompaniesTitle":"Similar Companies","similar_companies":[]},"mainContact":{},"_eventview":{"publicoffering_exit":[],"privateequityfunding":[{"id":"aFENlmkMOPUOKNRqWN30xCaLsVjyKQzjWZX8Y9loHzPssNTSTbUf9V","date":"Jan 2020","amount":"$4M","source":"Elad Caspi","eventtype":"FundingRoundEvent","investment":[],"eventvisibility":"Public","amountvisibility":"Public","fundingvisibility":"Public","fundingtypefundingtype":"Seed","style":"","hiddenCompanyTooltip":"","fundingvisibilityClassName":"","fundingvisibilityTooltip":"","amountvisibilityClassName":"","amountvisibilityTooltip":"","token_visibilityClassName":"","token_visibilityTooltip":"","sectionname":"Private Equity Funding","amountnumber":4000000,"capitalraised":"Undisclosed","valuation":"Undisclosed"}],"nonequityfunding":[],"merger_acquisitions":[],"others":[]}}