Company Overview
Snapshot
Founded in June 1999, CoreFlow operates with 11–50 employees. The company has raised $3.2M across one funding round from two investors. In December 2025, CoreFlow unveiled a new 310 mm O-310 mm vacuum stage designed to address significant warpage challenges in CoPoS panel-level packaging.
Business overview
CoreFlow specializes in advanced airflow management solutions for the semiconductor and electronics industries. The company develops non-contact, vacuum-based systems that utilize airflow technology to safely handle and transport delicate materials like glass and thin wafers, minimizing damage and contamination risks inherent in traditional handling methods. CoreFlow's technology aims to improve production yields, reduce product loss, and enhance product quality for manufacturers in the industrial manufacturing, discrete industries, semiconductors & electronics, and renewable energy systems sectors.
Strategic signal
In December 2025, CoreFlow unveiled a new 310 mm O-310 mm vacuum stage to address warpage challenges in CoPoS panel-level packaging. This innovation is critical for the semiconductor industry, as it offers up to 81% more usable area compared to traditional wafers and supports the growing demands of AI-driven applications. This product launch signals CoreFlow's continued commitment to advancing manufacturing processes and solidifies its position as a key technology provider in high-accuracy aerodynamic handling solutions.
Log in to access full profile ›Company Intelligence Q&A
- What is CoreFlow's core technology?
- CoreFlow specializes in non-contact, vacuum-based systems that use airflow technology for handling and transporting delicate materials in the semiconductor and electronics industries, minimizing damage and contamination.
- When was CoreFlow founded?
- CoreFlow was founded in June 1999.
- What was a significant product launch by CoreFlow in September 2024?
- In September 2024, CoreFlow launched the GripJet™ vacuum stage, designed for flattening and handling highly warped panels in Fan-out Panel Level Packaging (FOPLP) manufacturing processes. This product utilizes SmartNozzle™ selective vacuum technology to enhance productivity and reduce breakage.
- What new product did CoreFlow unveil in December 2025?
- In December 2025, CoreFlow unveiled a new 310 mm O-310 mm vacuum stage to address major warpage challenges in CoPoS panel-level packaging, offering increased usable area and compatibility with existing fab systems.
- Which industries does CoreFlow primarily serve?
- CoreFlow primarily serves the semiconductor and electronics industries, as well as industrial manufacturing, discrete industries, and renewable energy systems, including solar.