Newphotonics Overview
NewPhotonics specializes in optical connectivity solutions designed to tackle bandwidth and power challenges, especially in AI-driven applications. Their focus is on developing integrated photonic circuits and optical processing technologies to improve performance and energy efficiency for AI clusters. The company recently introduced new products like the second-generation photonic integrated circuit (PIC) with an integrated optical equalizer.
Cumulative Funding Raised Over Time ($)
$5.6MDec 2021
$35.6MFeb 2024
$52.8MJun 2022
$56.3MMar 2020
Latest News
growth-positive
/PRNewswire/ -- ShunYun Technology Ltd (SYT), a world-class manufacturer of optical transceivers, and NewPhotonics, a leading designer of highly integrated...
ShunYun Technology Ltd (SYT), a manufacturer of optical transceivers, has entered into a strategic partnership with NewPhotonics, a designer of photonic integrated circuit (PIC) chips. The partnership aims to scale up the volume manufacturing of NewPhotonics NPG product line to meet the growing demand for data center optical interconnect solutions. SYT will leverage its expertise in post-silicon manufacturing processes to support the production of PICs at scale. This collaboration is expected to enhance SYTs role as a key player in the optical interconnect market, particularly for hyperscalers and AI factories. The partnership is seen as a critical step in delivering innovative photonic IC solutions.
Partners
growth-positive
/PRNewswire/ -- SoftBank Corp. ('SoftBank') and NewPhotonics LTD ('NewPhotonics'), a leader in advanced integrated photonics, today announced a joint research...
SoftBank Corp. and NewPhotonics LTD have announced a joint research and development collaboration aimed at advancing photonics technologies for AI data centers and mobile fronthaul infrastructure. The partnership focuses on developing Linear-drive Pluggable Optics (LPO), Co-packaged Optics (CPO), and All-Optics Switch Fabric to enhance speed, reduce latency, and improve energy efficiency. This collaboration is expected to address power consumption and capacity bottlenecks in AI cluster workloads, thereby providing SoftBank with a significant market advantage. The partnership also aims to extend the distance of data transport equipment and reduce processing delays.
Partners
growth-positive
/PRNewswire/ -- NewPhotonics Ltd., a leader in advanced integrated photonics technologies, today introduced its NPG102 PIC transmitter on chip (TOC) at1.6Tbps...
NewPhotonics Ltd., a leader in advanced integrated photonics technologies, has introduced its NPG102 PIC transmitter on chip (TOC) at 1.6Tbps for DSP-based optical transceiver modules. This new product aims to meet the increasing AI-cluster processing demands on data center infrastructure by delivering low latency data communications at low power consumption. The monolithically integrated lasers and modulators improve system integration and accelerate OEM manufacturing yield maturity and time to market. The NPG102 TOC for DSP-based modules joins the companys suite of PIC solutions, supporting both DSP-based and LPO-based pluggable optics segments. Market availability is expected in the second quarter of 2025.
Customers
growth-positive
NewPhotonics Introduces Transmitter-on-Chip PIC with Integrated Equalizer for LPO and LRO Data Center Connectivity
NewPhotonics Ltd has introduced its second-generation photonic integrated circuit (NPG102) designed to improve latency and power performance for high-throughput optical interconnects in data centers. The new chip offers minimal latency and power performance at 800 GBps and 1.6 TBps, catering to the increasing demand for low-latency, high-speed optical connectivity driven by AI workloads. The NPG102 integrates various transmitter elements, including a laser, modulator, and optical equalizer, to ensure consistent optical link performance and extended distance. The chip simplifies system integration, improves OEM manufacturing yield, and enhances transceiver reliability. Sampling for the second-generation chip will begin in Q4 2024.
growth-positive
Intel and NewPhotonics Achieve Breakthrough with 224Gbps Electrical SerDes and Photonics Engine Integration
Intel Corporation and NewPhotonics Ltd have successfully integrated Intels new 224Gbps electrical SerDes design with NewPhotonics Photonics Engine, achieving an end-to-end direct modulation electrical-to-optical link using PAM4 modulation. This integration allows for a 224Gbps data transmission rate over 10 kilometers of single-mode fiber without the need for Digital Signal Processing (DSP), reducing costs and latency. The achievement was showcased at the ECOC conference in Glasgow from October 2-4, 2023. Both companies aim to further reduce energy consumption, processing delay, and costs while improving reliability and capacity in data centers.
Partners
| Sector | Industrial Technologies |
Funding
| Total funding | $69.14M |
| Last funding | $30M |
| Stage | Seed |
| Rounds | 5 |
| Investors | 4 |
Team Members
3
Employees: 51-200
Web & Social Links
| Website | newphotonics.com |
Locations
Petah Tikva, Israel
Photos & Videos
No files yet
Newphotonics Business
Business models
B2B
Product stage
Alpha
Employees
51-200
Sector
Climate TechLow Carbon DataSphereEnergy TechEnergy Consumption & EfficiencyIndustrial TechnologiesMicroelectronics & Photonics SolutionsTarget Customer
Enterprise & Professional ServicesITData CentersCore Technology
Semiconductors & ElectronicsChipsetsTags (9)
energytechenergy-efficiencyblockchainelectro-opticssemiconductorsartificial-intelligenceclimate-techdeep-learningquantum-computingNewphotonics Financials
$69.14M
Total funding
Undisclosed
Capital raised
$30M
Last funding
Seed
Funding stage
5
Total rounds
4
Investors
Cumulative Funding Raised Over Time ($)
$5.6MDec 2021
$35.6MFeb 2024
$52.8MJun 2022
$56.3MMar 2020
Private Equity Funding
Undisclosed Round
Feb 2024
$30M
DIVEdigital
Undisclosed Round
Jun 2022
$17.2M
NextLeap Ventures, Trirec VC, DIVEdigital, Awz Ventures
Seed
Dec 2021
$5.6M
Trirec VC, NextLeap Ventures, DIVEdigital
Pre-Seed
Mar 2020
$3.5M
Non-Equity Funding
GrantEvent
Oct 2022
$12.84M
EIC Accelerator, Israel Innovation Authority
Newphotonics Lifecycle
Cumulative Funding Raised Over Time
$5.6MDec 2021
$35.6MFeb 2024
$52.8MJun 2022
$56.3MMar 2020
All Events
Undisclosed Round
Feb 2024
$30M
DIVEdigital
Undisclosed Round
Jun 2022
$17.2M
NextLeap Ventures, Trirec VC, DIVEdigital, Awz Ventures
Seed
Dec 2021
$5.6M
Trirec VC, NextLeap Ventures, DIVEdigital
Pre-Seed
Mar 2020
$3.5M
GrantEvent
Oct 2022
$12.84M
EIC Accelerator, Israel Innovation Authority
Newphotonics News
6 articles
growth-positive
/PRNewswire/ -- ShunYun Technology Ltd (SYT), a world-class manufacturer of optical transceivers, and NewPhotonics, a leading designer of highly integrated...
ShunYun Technology Ltd (SYT), a manufacturer of optical transceivers, has entered into a strategic partnership with NewPhotonics, a designer of photonic integrated circuit (PIC) chips. The partnership aims to scale up the volume manufacturing of NewPhotonics NPG product line to meet the growing demand for data center optical interconnect solutions. SYT will leverage its expertise in post-silicon manufacturing processes to support the production of PICs at scale. This collaboration is expected to enhance SYTs role as a key player in the optical interconnect market, particularly for hyperscalers and AI factories. The partnership is seen as a critical step in delivering innovative photonic IC solutions.
Partners
growth-positive
/PRNewswire/ -- SoftBank Corp. ('SoftBank') and NewPhotonics LTD ('NewPhotonics'), a leader in advanced integrated photonics, today announced a joint research...
SoftBank Corp. and NewPhotonics LTD have announced a joint research and development collaboration aimed at advancing photonics technologies for AI data centers and mobile fronthaul infrastructure. The partnership focuses on developing Linear-drive Pluggable Optics (LPO), Co-packaged Optics (CPO), and All-Optics Switch Fabric to enhance speed, reduce latency, and improve energy efficiency. This collaboration is expected to address power consumption and capacity bottlenecks in AI cluster workloads, thereby providing SoftBank with a significant market advantage. The partnership also aims to extend the distance of data transport equipment and reduce processing delays.
Partners
growth-positive
/PRNewswire/ -- NewPhotonics Ltd., a leader in advanced integrated photonics technologies, today introduced its NPG102 PIC transmitter on chip (TOC) at1.6Tbps...
NewPhotonics Ltd., a leader in advanced integrated photonics technologies, has introduced its NPG102 PIC transmitter on chip (TOC) at 1.6Tbps for DSP-based optical transceiver modules. This new product aims to meet the increasing AI-cluster processing demands on data center infrastructure by delivering low latency data communications at low power consumption. The monolithically integrated lasers and modulators improve system integration and accelerate OEM manufacturing yield maturity and time to market. The NPG102 TOC for DSP-based modules joins the companys suite of PIC solutions, supporting both DSP-based and LPO-based pluggable optics segments. Market availability is expected in the second quarter of 2025.
Customers
growth-positive
NewPhotonics Introduces Transmitter-on-Chip PIC with Integrated Equalizer for LPO and LRO Data Center Connectivity
NewPhotonics Ltd has introduced its second-generation photonic integrated circuit (NPG102) designed to improve latency and power performance for high-throughput optical interconnects in data centers. The new chip offers minimal latency and power performance at 800 GBps and 1.6 TBps, catering to the increasing demand for low-latency, high-speed optical connectivity driven by AI workloads. The NPG102 integrates various transmitter elements, including a laser, modulator, and optical equalizer, to ensure consistent optical link performance and extended distance. The chip simplifies system integration, improves OEM manufacturing yield, and enhances transceiver reliability. Sampling for the second-generation chip will begin in Q4 2024.
growth-positive
Intel and NewPhotonics Achieve Breakthrough with 224Gbps Electrical SerDes and Photonics Engine Integration
Intel Corporation and NewPhotonics Ltd have successfully integrated Intels new 224Gbps electrical SerDes design with NewPhotonics Photonics Engine, achieving an end-to-end direct modulation electrical-to-optical link using PAM4 modulation. This integration allows for a 224Gbps data transmission rate over 10 kilometers of single-mode fiber without the need for Digital Signal Processing (DSP), reducing costs and latency. The achievement was showcased at the ECOC conference in Glasgow from October 2-4, 2023. Both companies aim to further reduce energy consumption, processing delay, and costs while improving reliability and capacity in data centers.
Partners
growth-positive
NewPhotonics on LinkedIn: The biggest revolution at OFC 2023
At the OFC Conference, NewPhotonics from Israel presented a live demo of their new silicon photonic chip. The chip is capable of achieving 4 X 224Gig on a single silicon photonic chip using standard SiP modulators and TDM. This could potentially increase data processing capacity significantly. The companys CTO, Yosef Ben-Ezra, invited attendees to witness the demo at the Credo booth. The overall theme of the conference was the capacity of data that can be processed per second on a single chip.
Customers
Newphotonics Team
Employee Info
| Employees (range) | 51-200 |
| Exact count | 55 |
| Team members | 3 |
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Newphotonics Internal
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Admin Info
| Confidence | 89/100 |
| Missing | video or image, markets, not claimed |
| BI Verification | Maor Perlov |
| Registrar ID | 516139730 |
| Crunchbase | newphotonics |
| Creator | Maor Perlov |
| Creator email | maorperlov@gmail.com |
| Last updater | Maor Perlov |
| Updater email | maor.perlov@sncentral.org |
| Last update | 2024-09-15T00:00:00.000Z |
| Created | 2022-05-16T00:00:00.000Z |
| Claimed | Yes |